Engineering Live: TE Connectivity - Formula E

Learn How MiniMRP is Reducing Avionics Packaging Up to 40%!

In this Engineering Live, coming to you live from the Paris Airshow, we discuss: • How increased computing power in a smaller package is possible utilizing MiniMRP avionics packaging to replace the big box avionics bay approach,

Engineering Live: Discrete Semiconductors

Engineering Live: Discrete Semiconductors

Engineering Live: Discretes Do Matter On Demand

n this Engineering Live we explore the primary differences between discrete semiconductors and Integrated Circuits (ICs) or Microprocessors, and further, we clarify why many discrete semiconductors are not easily integrated into an integrated circuit

Engineering Live: Paths for Automotive Tier Suppliers to Gain a Competitive Edge